AionSi — Driven by Commitment
04ENGINEERING CAPABILITY

DFT

Manufacturing-test readiness

Design-for-test engineering integrated into the silicon lifecycle.

Test ArchitectureScanATPG
01Requirement
02Engineering implementation
03Verification / analysis
04Closure
05Handoff / sign-off

Start with the engineering problem.

Choose the situation closest to your program to see the engineering impact, AionSi contribution and appropriate engagement path.

01
Customer situation

DFT readiness is becoming a silicon schedule constraint.

Specialist Engineering
Engineering impact

Scan, ATPG and coverage closure must progress alongside implementation.

AionSi contribution

Test architecture, scan, ATPG and DFT sign-off support.

Engagement model

Specialist Engineering

Discuss Your Engineering Requirement →
02
Customer situation

DFT workstreams need defined execution and closure ownership.

Managed Workstream
Engineering impact

Pattern generation, debug and sign-off activities compete with core design milestones.

AionSi contribution

Managed DFT workstream from planning through sign-off.

Engagement model

Managed Workstream

Discuss Your Engineering Requirement →
03
Customer situation

Multiple silicon programs need scalable DFT execution.

Dedicated Engineering ODC
Engineering impact

Program teams need repeatable methodology and capacity.

AionSi contribution

Dedicated DFT engineering aligned to the product roadmap.

Engagement model

Dedicated Engineering ODC

Discuss Your Engineering Requirement →
Test ArchitectureScanATPG
01Manufacturing-test readiness
02Structured execution and handoff
03Scalable engineering capacity

Validate capability depth with technical evidence.

Move from capability → evidence → engineering conversation without relying on unsupported customer claims.

Bring the engineering problem.

Share the program stage, bottleneck and required engineering capacity. We can map the requirement to the appropriate AionSi engineering model.

Discuss Your Engineering Requirement