Technology depth for complex silicon.
A focused set of technology domains backed by supplied AionSi technical capability evidence across connectivity, memory, interconnect and processor IP.
Only source-backed technology domains are presented in this matrix. Lower-confidence or unsupported claims are intentionally excluded from the technology evidence layer.
Six strong technology domains.
Each card is intentionally tied to a supplied technical capability document and an existing evidence reference path.
PCIe Gen6
Production-grade Data Link Layer engineering with link training, flow control, error recovery, power management and SoC integration.
- • 64 GT/s Gen6 per lane
- • Gen3 / Gen4 / Gen5 backward compatibility
- • UVM/SystemVerilog verification with >95% coverage targets
USB 3.x / USB4
Integrated USB controller engineering spanning PHY, link and protocol layers, power delivery, error recovery and host/device integration.
- • USB 3.2 Gen 2x2 at 20 Gbps and USB4 at 40 Gbps
- • Host and device modes
- • UVM verification with USB-IF compliance scenarios
DDR4 / DDR5
Memory-controller engineering covering command scheduling, PHY abstraction, refresh management, ECC/RAS, timing and SoC integration.
- • Up to 7.2 Gbps per pin for DDR5
- • Up to 8 channels
- • SECDED and optional Chipkill ECC
HBM2e / HBM3
High-bandwidth memory controller engineering for AI, GPU and HPC systems with QoS-aware scheduling and thermal-aware integration.
- • 14.4 / 17.1 Gbps per pin
- • 1.8–2.4 TB/s per stack
- • 8–16 AXI/CHI client ports
AMBA CHI / AXI
Coherent and non-coherent interconnect engineering for heterogeneous SoCs with QoS, configurable topology, monitoring and scalable agent counts.
- • CHI-E/D with 8–32 coherent agents
- • 16+ AXI clients with QoS prioritization
- • Crossbar, tree and ring topologies
RISC-V
Processor-core engineering spanning embedded, edge-AI, performance and multi-core cluster tiers with formal and dynamic verification.
- • RV32I / RV64I with optional Vector, Floating-Point and Crypto extensions
- • 2–8 core cluster configurations
- • AXI / CHI coherent memory interfaces
Technology is connected to the silicon workflow.
The evidence set covers architecture and IP definition through verification and SoC integration. Physical-design, DFT and standalone AI-accelerator silicon claims are deliberately kept outside this technology evidence layer until equivalent source material is available.
Architecture & RTL
Applied across the supplied PCIe, USB, DDR, HBM, AMBA and RISC-V evidence domains.
Design Verification
Applied across the supplied PCIe, USB, DDR, HBM, AMBA and RISC-V evidence domains.
Protocol Verification
Applied across the supplied PCIe, USB, DDR, HBM, AMBA and RISC-V evidence domains.
SoC Integration
Applied across the supplied PCIe, USB, DDR, HBM, AMBA and RISC-V evidence domains.
Have a technology-specific silicon requirement?
Bring the protocol, memory, processor or SoC integration challenge. We will map it to the appropriate AionSi engineering team and evidence path.