AionSi — Driven by Commitment
06ENGINEERING CAPABILITY

SoC & IP Engineering

Integration-ready IP, subsystem and SoC delivery

Engineering across processor, interconnect, memory, security and high-speed protocol IP with SoC integration.

RISC-VAMBA CHI / AXIPCIe Gen6DDR4 / DDR5HBM2e / HBM3USB 3.x / USB4Secure SoC
01Requirement
02Engineering implementation
03Verification / analysis
04Closure
05Handoff / sign-off

Start with the engineering problem.

Choose the situation closest to your program to see the engineering impact, AionSi contribution and appropriate engagement path.

01
Customer situation

IP integration or subsystem development is consuming core SoC bandwidth.

Specialist Engineering
Engineering impact

Integration dependencies and interface issues slow system progress.

AionSi contribution

IP integration, subsystem development and SoC integration engineering.

Engagement model

Specialist Engineering

Discuss Your Engineering Requirement →
02
Customer situation

A defined subsystem needs execution through integration milestones.

Managed Workstream
Engineering impact

Internal teams need an external workstream without losing architectural control.

AionSi contribution

Managed subsystem or IP engineering workstream with milestone ownership.

Engagement model

Managed Workstream

Discuss Your Engineering Requirement →
03
Customer situation

Multiple IP and SoC programs require sustained external engineering.

Dedicated Engineering ODC
Engineering impact

Scaling execution across programs becomes a management challenge.

AionSi contribution

Dedicated IP / SoC engineering organization aligned to roadmap and governance.

Engagement model

Dedicated Engineering ODC

Discuss Your Engineering Requirement →
RISC-VAMBA CHI / AXIPCIe Gen6DDR4 / DDR5HBM2e / HBM3USB 3.x / USB4Secure SoC
01Integration-ready IP, subsystem and SoC delivery
02Structured execution and handoff
03Scalable engineering capacity

Evidence before claims.

Explore approved technical material supporting the engineering capability represented on this page.

01architecture

RISC-V Processor Core Family

AionSi processor portfolio spanning embedded through performance and multi-core cluster tiers, with RV32/RV64 support and AXI/CHI integration.

Technical evidence →
02architecture

AMBA CHI & AXI Interconnect Fabrics

AionSi CHI and AXI fabric portfolio covering coherent interconnect, QoS, configurable topologies and heterogeneous SoC integration.

Technical evidence →
03architecture

PCIe Gen6 Data Link Layer

PCIe Gen6 DLL IP covering LTSSM, flow control, packet processing, error detection/recovery and power management.

Technical evidence →
04architecture

DDR4 & DDR5 Memory Controllers

Memory-controller portfolio covering command scheduling, PHY abstraction, refresh management, ECC and RAS.

Technical evidence →
05architecture

HBM2e & HBM3 Memory Controllers

High-bandwidth memory controller portfolio covering arbitration, QoS-aware scheduling, thermal management and AXI/CHI interfaces.

Technical evidence →
06architecture

USB 3.x & USB4 Controllers

USB controller portfolio covering PHY/link/protocol layers, link training, power delivery and error recovery.

Technical evidence →
07case-study

Tarang SoC Engineering Experience

Representative SoC engineering experience spanning RISC-V, PCIe Gen6, DDR4/LPDDR4, HBM, USB3, Ethernet, security, FPGA prototyping and embedded software.

Technical evidence →
08whitepaper

OpenTitan Cryptography & Secure SoC Integration

Technical reference covering OpenTitan Darjeeling-based secure SoC integration, Earl Grey context, hardware cryptography, secure boot, key management and security-oriented verification.

Technical evidence →

Bring the engineering problem.

Share the program stage, bottleneck and required engineering capacity. We can map the requirement to the appropriate AionSi engineering model.

Discuss Your Engineering Requirement